Electromechanics
ПМ-3 — thermal control with heat recovery
A thermal management system for a computing device that reuses the heat removed. The project aims to coordinate device cooling with useful recovery of the heat flow.
CHALLENGE AND SOLUTION
What we are developing
Maintain the agreed temperature range for the computing device.
Provide controlled heat removal.
Assess heat reuse under the conditions of a specific site.
- Cooling and heat recovery addressed together.
- A proposed link to the Energy AI computing system.
- A separate patent for the thermal control assembly.
DEVELOPMENT STATUS
Where the project stands
Current confirmed stage
Patented solution described; bench testing of the selected configuration is still to come
Next work
Define the thermal load and installation conditions. / Calculate and assemble an experimental thermal circuit. / Measure temperatures, control modes and available heat flow.
Validation and delivery of results
The test programme and acceptance criteria are defined for each project. A patent alone does not mean this stage is complete.
Energy savings and the share of useful heat have not been measured in the verified materials. The patent does not establish environmental qualification of the device. Claims of operation at −40 °C require a test report for that configuration.
Next step
- Define the thermal load and installation conditions.
- Calculate and assemble an experimental thermal circuit.
- Measure temperatures, control modes and available heat flow.
INTELLECTUAL PROPERTY RIGHTS
Documented status
Patent RU246505U1 dated 14.10.2026; in force. Status checked in the public FIPS register on 11.11.2026.
Rights information and technical readiness are shown separately. A patent or registration certificate is not a test report.
PUBLIC EVIDENCE
Documents and sources
Patent RU246505U1 dated 14.10.2026; in force.
- FIPS register ↗
- Official publication (PDF) ↗
- Patents and applications in the YASNOCORE legal register ↗
Public sources checked on 11.11.2026. The scope of rights and compatibility is defined by the relevant document.